Job Description

Experience: 7 - 15 Years

Location: Austin, Texas

Mandatory Requirement:

• 5+ years (or equivalent) of analog / mixed-signal IC design experience, including complex high-speed blocks such as DACs, ADCs, PLLs, SerDes-related analog, high-speed timing circuits, phase interpolators, etc., with top-level/system understanding. 

• Experience designing in advanced process nodes such as FinFET and/or GAA. 

• Meaningful industry tapeout exposure and familiarity with signoff/tapeout procedures (strong preference for being “around a couple of tapeouts”). 

• Proficiency with Cadence custom/analog design tools (Virtuoso / ADE) and Spectre. 

• Hands-on design experience must be silicon IC design (on-chip RF/AMS). (Note: PCB / antenna-only RF backgrounds are not a fit for this role)

• B.S. in Electrical Engineering / Computer Engineering (or equivalent) required. 

• Ability to work on-site in Austin, TX, 5 days a week.

About the Role

Build the analog front-end (AFE) that interfaces a next-generation coherent optical DSP with optical modules. This is cutting-edge analog/RF/mixed-signal IC design at extreme bandwidths and tight performance margins in advanced technology nodes (FinFET / GAA).

This role sits within the growing Austin, TX team (a key nucleus of our broader analog organization)

Responsibilities

• Design and deliver high-speed analog/mixed-signal/RF silicon circuits enabling wideband TX/RX chains (DAC/ADC-based AFE for coherent optical).
• Own block execution end-to-end: participate in/challenge spec definition, explore architectures/topologies, and drive circuit implementation in advanced nodes.
• Develop ultra-wideband building blocks (e.g., wideband amplifiers/drivers and other high-speed analog circuits) to meet aggressive requirements for bandwidth, linearity, noise, and power.
• Partner closely with layout/physical design to guide implementation for high-speed, low-noise performance; run post-layout optimization and close on signoff-quality results.
• Integrate blocks into the full analog system and support tapeout/signoff readiness through reviews, documentation, and cross-site collaboration.

Must Haves

• 5+ years (or equivalent) of analog / mixed-signal IC design experience, including complex high-speed blocks such as DACs, ADCs, PLLs, SerDes-related analog, high-speed timing circuits, phase interpolators, etc., with top-level/system understanding.
• Experience designing in advanced process nodes such as FinFET and/or GAA.
• Meaningful industry tapeout exposure and familiarity with signoff/tapeout procedures (strong preference for being “around a couple of tapeouts”).
• Proficiency with Cadence custom/analog design tools (Virtuoso / ADE) and Spectre.
• Hands-on design experience must be silicon IC design (on-chip RF/AMS). PCB / antenna-only RF backgrounds are not a fit for this role.

Nice to Haves

• Direct experience in high-speed DAC design (especially TX path) and/or high-speed ADC interface design.
• Demonstrated success designing ultra-wideband amplifiers/drivers in scaled nodes.
• Verilog-A and/or MATLAB modeling experience.
• Strong communication, collaboration, and ownership mindset in a fast-moving, cross-site environment.

Education

• B.S. in Electrical Engineering / Computer Engineering  (or equivalent) required.
• M.S. / PhD is a plus; we consider equivalent combinations of education and industry impact (e.g., deeper tapeout experience can offset less graduate education).

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